ABLESTIK JM7000具有高可靠性，低空洞特點，耐高溫可達370度。

常用超大規(guī)模集成電路封裝，陶瓷焊接封裝和焊接密封封裝

樂泰EA 3335透明UV耐熱耐水耐腐蝕光通訊光路膠

粘度 5000-7000cp 固化條件 UV 硬度80shoreA Tg值 135℃ CTE,低于Tg溫度59ppm/℃ CTE,Tg值溫度 ppm/℃

透明，UV快速固化，良好的耐熱，耐水，耐化學(xué)腐蝕性，低揮發(fā)。

TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength:
2 X 2 mm Si die, kg-f,
cured 20 minutes @ 150oC
Substrate DSS
Ag/Cu LF ≥5
Tensile Strength :
cured 30 minutes @ 300oC, MPa
After Cure After 1000 TC'C"
>17 >17
Radius of Curvature:
Si die on Alumina, meters
cured 30 minutes @ 300oC
Chip Size: ROC
15 x 15 mm > 5